Yield Enhancement Engineer - Physical Failure Analysis (APTD)

Assist with the root cause analysis for process deviations. Provide analysis of process experiments, assist with identification of yield excursions. Support the transfer of physical failure analysis processes into production. Work with other engineering teams to resolve yield issues. Create and maintain yield issue statistics and pareto for clear understanding to all engineering teams. Support and develop new tools and techniques to localize and identify device failures. Recognize, identify, and raise awareness of process issues to appropriate teams. Train and mentor new engineers/technicians on all fault isolation techniques, tooling and procedures. Attend meetings and present results to Product Development and Process Integration teams. Possibly travel to manufacturing sites during transfer of next-generation processes, using the latest physical failure techniques. Intermediate understanding of device physics as well as familiarity with semiconductor manufacturing and the fabrication processes areas involved. Strong communication and presentation skills. Digital literacy, including confirmed knowledge of Windows, JMP statistic software, C++, Perl, Python, and Microsoft Office. Theory and/or operation of scanning electron microscopes (SEM), focused ion beam (FIB), Transmission emission microscopes (TEM), and Elemental Analysis (EDS, EELS). PhD/MS in following subject areas: Electrical Engineering, Chemical Engineering, Materials Science Engineering, Physics, or related fields. Or BS degree in one of the subject areas along with 7+ years of industry related experience. One-to-three years' work experience with volatile/non-volatile memory and advanced package parts/processing. Knowledge of memory architecture and cell operation and related topics. Exceptional analytical and problem-solving skills, high motivation, and a strong work ethic so you will be able to work independently once trained.