Provide SEM/FIB support for FAB 4 YE Advanced Packing parts Operate and perform minor maintenance on SEMs and Dual Beams (FIB/SEM) Prepare samples for SEM/Dual Beam analysis, including safe operation of the acid hood, sputter coaters, ion millers, UV cleaners, March/Oxford etchers, SELA (micro-cleaving tool), CMP, Nikon Optiphot, and Zeiss Microtronics optical microscopes Perform physical failure analysis employing SEM, FIB, de-layering, and other advanced techniques Communicate effectively with part type engineers regarding requests, priorities, and general communications about the queue Associate's degree in Engineering or related technical field, or 2+ years of equivalent semiconductor industry experience Strong understanding of FAB process steps, including wet etch, dry etch, PVD, ALD, and CMP Consistent record of prioritizing tasks, working independently, and managing multiple assignments successfully Outstanding communication skills, both written and verbal, with the ability to present information clearly Analytical skills to identify problems and implement effective resolutions Proficient PC skills, including MS Office applications (PowerPoint, Word, Excel, OneNote) Flexibility to work any shift and overtime as needed, including nights, weekends, and holidays Experience in semiconductor physical failure investigation
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