The candidate should have a drive for technical program management and possess effective communication skills; this is a strategic role and will suit someone who can drive growth in partnership with a cross-functional team. Coordinate with business unit and AGS Focal to generate initial Cost of Ownership models with focus on quantification and optimization of Preventative Maintenance / Corrective Maintenance (PM/CM) labor and material costs. Ensure field service team is prepared to support service contracts under DDP products by coordinating with FSO managers and AGS cross functional owners that proper training and documentation is provided to their field teams. Promote and implement AGS service elements (i.e., component Engineering, Aix, Materials Engineering) to enable field service to meet or exceed committed installed base performance metrics at expected margins. Develop CIP products beyond scope of component engineering for unique requirements for key and critical sites that have major contract impact or major potential upsell to Managed or greater contracts. Monitor, trend, and drive improvements in global customer installed base key productivity indicators (KPIs) for Managed Tools or higher contract that include tool uptime and PM G2G performance. Bachelor's or Master's Degree in Engineering GPA of 3.5 or above preferred Prior Semiconductor Equipment Experience Strong communication skills, takes initiative and strong reporting skills. Experience in semiconductor processing or manufacturing is preferred. Engineering experience with a strong business background and or manufacturing of capital equipment is preferred Quick learner and comfortable presenting technical and financial data to the team. Experienced in PPT presentations, Project management, 3D Modeling, Excel & Word.
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