Intern - Advanced Packaging TD

Lead problem-solving activities using structured methodologies such as KT (Kepner-Tregoe) Define and implement Design of Experiments (DoE) for process development Present findings and collaborate across sites and teams Support line monitoring through project management and yield improvement initiatives Develop new line monitoring methods and critical metrics Currently enrolled in an accredited university with expected graduation no earlier than Fall 2026 Excellent data extraction, analysis, and reporting skills (e.g., system analytics, JMP) Strong collaboration and communication skills across multi-functional teams Ability to prioritize multiple complex tasks and adapt to changing responsibilities Tenacity to work under timelines and limited resources Experience with semiconductor process technologies Familiarity with structured problem-solving and decision-making frameworks Exposure to experimental design and statistical analysis tools Interest in advanced packaging and interconnect development