Conduct research and development to support new advanced packaging solutions Plan and implement well-designed experiments and report findings clearly Drive continuous process improvements to meet yield, quality, and cycle time targets Collaborate with multi-functional teams to implement and monitor process changes In progress of obtaining BS/MS in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering or a related field (Graduation date should not be prior to September 2026) Strong focus on detail and achieving goals Ability to proactively solve problems and adapt in a dynamic environment Proven experience or research in a semiconductor-related field Knowledge of statistics, mathematics, and machine learning algorithms Excellent interpersonal and communication skills (written, verbal, and presentation) Experience with data analysis tools such as JMP or similar platforms Familiarity with semiconductor packaging processes or materials Demonstrated ability to work effectively in global, multi-functional teams Strong documentation and reporting skills
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