Intern, Mechanical Simulation for Advanced Packaging

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  We are offering an exciting opportunity at SK Hynix USA for IC Packaging Thermal-Mechanical Modeling Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in mechanical modeling and characterization of advanced packages. You will be introduced to the basics of the advanced package design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success.

  
  


• Project Assignment: Thermo-mechanical stress analysis on advanced package architecture

• Become familiar with various IC packaging structures and the process steps involved in making the end product.


• Learn the basics of using numerical analysis tools such as Abaqus etc.


• Start developing package level mechanical Finite Element Analysis (FEA) Models to characterize stress/strain in the packages due to various assembly process steps.


• Start developing simple FEA models to capture the various accelerated testing conditions that ensures long term package reliability.


• Learn to interpret the mechanical behavior of models and simulation results and correlate to observed behavior and measurements.


• Document all simulation models, codes and scripts and present the results in simple and clear terms to a broader audience.

Qualifications: 

• Currently pursuing a Master's or PhD's degree in Mechanical Engineering, Materials Science, or a related field.


• Strong interest in solid mechanics, finite element analysis and its applications in semiconductor packaging.


• Strong problem-solving and analytical skills.


• Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.

Preferred Skills 

• Currently pursuing a PhD's degree in Mechanical Engineering, Materials Science, or a related field.


• Familiarity with FEA software (e.g., ANSYS) is a plus.


• Basic understanding of semiconductor packaging concepts and materials is advantageous.