Process Engineering Intern - Summer 2026

Participate in projects by applying engineering methodolgy towards developing features on Lam's CVD system to further enhance equipment and reactor performance for advanced packaging. Support lab C&F tests to advance and innovate wafer chucking and clamping detection technology. Lab test apparatus setup, hardware tuning, operations of lab deposition development tool, data collection, use of metrology tools to measure on wafer deposition performance and results reporting. Plan and execute concept and feasibility studies of novel metal thin film deposition processes, chemistries, and materials. Work in laboratory and clean-room environments to conduct experiments using laboratory equipment. Summarize and analyze experimental test data. Present and discuss experimental conclusions with cross-functional teams of engineers and management. Conduct and share literature reviews on relevant research topics. Participate in customer demos of new processes and equipment. Must be a undergraduate Student (Bachelor) in Chemical Engineering or Materials Science/Engineering. Hands-on experience in a laboratory setting working with thin films, semiconductor devices, PVD, ALD, etc. Experience with thin film analytical methods such as SEM/TEM, XPS, XRD, XRD, Fluent in English language with strong writing and verbal communication skills. Proficient in PowerPoint to adequately convey project status, experimental plans and conclusions. Proficient in carrying out detailed studies of ALD/CVD processes. Understanding of chemical mechanisms in semiconductor materials processing. Experience with plasma for depositing and etching of thin films. Understanding of problem-solving and troubleshooting techniques such as SPC, DOE, 5-why, fishbones, etc.