6723 - TCB Equipment Application Engineer (Semiconductor $7K–$10K North SG)

Position title : Senior TCB Application & Technical Sales Engineer

Location: Admirax St

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 7,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.

• Support technical sales activities and customer discussions.

• Benchmark competitor equipment and identify technology gaps.

• Translate customer requirements into internal equipment specifications.

• Develop and optimize TCB process parameters on TCB Equipments.

• Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.

• Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.

• Conduct DOE and process characterization activities.

• Work closely with Mechanical, Software, Electrical, Motion and Vision teams.

• Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.

• Lead machine qualification, FAT and SAT activities.

• Act as the internal customer during machine development.

• Support customer buyoff and onsite qualification activities.

Requirements:

• Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.

• 5–15 years of semiconductor packaging experience preferred.

• Hands-on experience in TCB, Flip Chip and Advanced Packaging.

• Experience in HBM / CoWoS / 2.5D / 3D packaging.

• Experience in OSAT, IDM or semiconductor equipment environments preferred.

• Experience with fluxless or N2 bonding environment is an advantage.

• Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.

• Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.
  

  
  📲Interested candidates, please WhatsApp your resume to: +65 9642 0989 (Han) 📧 Or email your resume to: [email protected]

  👤Chaw Chiaw Han | R22106723🏢 The Supreme HR Advisory Pte Ltd | EA 14C7279