Engineer, Equipment

Introduction
We are a new startup at the forefront of semiconductors integration, emerging from the new horizon of the semiconductor advanced packaging inflection point of chiplets. We are looking for Equipment Engineers with experience in Advanced Packaging, in this role you will provide technical leadership to startup of next generation of Fanout packaging equipment, optimize equipment capability, quality, and utilization through CIP to meet company's goals.

Responsibilities

• Have an in-depth understanding of how process equipment working principle and how critical parameters will impact process and to work together with process counterpart to resolve complex integration issues
• Manage and plan new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production
• Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality, cost, and productivity
• Liaise with vendors to resolve equipment issues and improve equipment performance of equipment to enhance quality, yield, cost reduction and productivity
• Identify and assess any safety and product risks, recommends risk eliminations, and control risk through mitigations and safe work procedures
• Initiate meeting with both process and manufacturing Engineers to ensure work is carried out efficiently to meet group objectives
• Lead and implement equipment improvement projects to improve equipment efficiency, cost reduction and reliability of equipment
• Forecast financial budgets for equipment expenditures. Setup tracking system to monitor expenditures
• Set targets, goals, and projects for the section to minimize scrap, equipment cost, optimize equipment capability and utilization to meet operational needs
• Provide feedback / training to AEs and TAs on their troubleshooting skills, equipment knowledge, decision making, risks assessment
• Familiar and follow up on SPSR, MRB, 8D, TECN, ECN ISO9001/QS9000/TQM documentation for closure of issues / setup system
• Self-audit and update specifications to meet company Quality Standard requirements
• Set expectation and carry out performance appraisal for Technician or AE as instructed by Manager. Help the AE or Engineer on their career path development
• Provide long term solution to address daily issues. Resolve department hardware chronicle issues
• Possess knowledge on SPC, DOE, FDC, ECMS and all the statistical analysis tools to help optimizing equipment robustness
• Able to coach Engineers in performing hardware trouble shooting
• Establish stock levels of essential spare parts and consumables to support equipment maintenance based on forecasted manufacturing volume. Liaise with vendors to minimize / eliminate over-stock or under-stock

Requirements

• Bachelor's degree in Electrical / Electronics / Mechanical / Mechatronics /Microelectronics Engineering
• Diploma candidates with min 8 years of work experience in similar role
• At least 5 years of relevant experience in equipment engineering for senior level, preferably in a semicon/LCD industry
• Hands-on experience in equipment maintenance or troubleshooting
• Self-driven leader and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem-solving with strong analytical skills
• Proven ability to identify, assess and solve problems
• Ability to work under pressure & in a Dynamic Environment

Wafer-level Fanout /WLCSP packaging experience

• Die preparation: Backgrind, Dicing, Laser-grooving
• Recon: Die PNP / Molding/ De-bonding
• Experience working with high precision die-bonder flip chip bonder like Datacon Chameo/ Nucleus