Engineer, NPI

Position Summary

The NPI Engineer will be responsible for supporting new product introduction (NPI) activities and ensuring smooth transition from development to high-volume manufacturing. This role will work closely with cross-functional teams to establish, qualify, and optimize manufacturing processes across semiconductor operations including lithography, wet processes, die preparation, pick-and-place (PnP), reconstitution (recon), molding, and other backend processes.

Responsibilities 

New Product Introduction (NPI) 

• Lead and support NPI builds from prototype through engineering and qualification stages to mass production.  

• Drive process setup, line readiness, and material qualification for new products.  

• Collaborate with R&D, Product Engineering, and Quality teams to ensure manufacturability and process robustness.  

• Develop and review process flow, work instructions, FMEA, and control plans for new products.  

• Coordinate engineering builds, monitor progress, and resolve technical issues during NPI phases.  

• Support customer requirements, audits, and documentation for product qualification.  

Process Engineering & Operations Support 

• Provide technical support for assigned backend processes 

• Troubleshoot process excursions, yield issues, and equipment-related problems.  

• Analyze process data, SPC trends, and implement corrective and preventive actions (CAPA).  

• Drive continuous improvement initiatives to enhance yield, quality, and cycle time.  

• Support production in achieving output, quality, and cost targets.  

• Work closely with Equipment, Quality, Production, and Supply Chain teams to ensure seamless operations.  

• Interface with suppliers and vendors for material and equipment-related qualifications.  

• Participate in design reviews and provide DFM (Design for Manufacturability) feedback.  

• Maintain accurate documentation for process specifications, changes, and qualifications.  

• Ensure compliance with internal standards, customer requirements, and industry regulations.  

• Support audits (internal, customer, and certification audits).  
  

Requirements

• Bachelor’s Degree in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or related field.  

• At least 5 years of experience in semiconductor manufacturing, preferably in backend/advanced packaging.  

• Experience in NPI, process development, or high-mix manufacturing environment is an advantage.  

• Familiarity with semiconductor processes such as lithography, wet, die prep, PnP, recon, and molding.  

• Strong problem-solving skills with knowledge of root cause analysis tools (e.g., 8D, Fishbone, FMEA).  

• Experience with SPC, DOE, and data analysis tools is preferred.  

• Good communication and stakeholder management skills.  

• Ability to work in a fast-paced, high-volume manufacturing environment.  

• Knowledge of advanced packaging technologies (e.g., fan-out, wafer-level packaging).  

• Hands-on experience with automation and MES systems.  

• Six Sigma / Lean certification is a plus.