Engineer – Plating/ Wet Process

Responsibilities:

Plating Process Engineering

• Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.)
• Monitor plating bath performance through regular analysis and corrective actions
• Perform DOE, capability studies, and process qualification for new plating chemistry or equipment
• Lead troubleshooting activities for plating defects such as voids, roughness, nodule formation, non-uniformity, and poor adhesion
• Establish and maintain plating process parameters, SOPs, and control plans

Wet Process Support (Etching, Cleaning, Stripping)

• Support wet etching processes (acid, alkaline, micro-etch) and ensure etch rate stability and uniformity
• Optimize surface preparation steps prior to plating such as micro-etch, oxide removal, and plasma/aquatic cleaning
• Monitor and sustain wet chemistry tanks (etchants, cleaners, developers, strippers) through SPC and scheduled chemical analysis
• Drive root-cause analysis for wet process issues including over-etch, under-etch, residue, or surface contamination

Laboratory Support

• Conduct chemical titration, CVS, TOC, and other plating bath analytical methods
• Prepare samples, test coupons, and run lab-scale plating and etching experiments
• Support failure analysis through cross-sectioning, microscopy (SEM/OM), and surface characterization
• Maintain calibration and good housekeeping of lab tools, chemical inventory, and safety compliance

Yield Improvement & Quality

• Analyze process data to identify trends and drive yield improvement actions
• Support customer audit requirements, documentation, and technical reporting
• Collaborate with Quality, Production, and R&D teams to resolve product or process quality issues

Equipment & Safety

• Support installation, preventive maintenance, and troubleshooting of plating and wet process equipment
• Ensure compliance with EHS guidelines for chemical handling, waste disposal, ventilation, and PPE usage
• Participate in safety risk assessments for chemical operations

Requirements:

• Degree in Chemical Engineering, Materials Engineering, Chemistry, or related technical field
• Experience in electroplating, Semiconductor packaging, or chemical wet processes preferred
• Knowledge of plating chemistry, solution analysis, and surface finishing technologies
• Familiarity with SPC, DOE, FMEA, and root-cause analysis tools
• Strong analytical, documentation, and problem-solving skills