Microelectronic Assembly Engineer

Key Responsibilities
• Lead and oversee microelectronics assembly processes, including die attach, wire bonding, equipment setup, and process optimization.

• Develop and qualify microelectronic packaging solutions, assembly processes, and documentation to support aerospace and defense products.

• Support new product development (NPD), prototype builds, first articles, and pre-production, ensuring designs are manufacturable.

• Work with RF ICs, substrates, capacitors, inductors, and other microelectronic components while ensuring compliance with quality and engineering standards.

• Train and mentor assembly personnel, drive continuous process improvements, and support products throughout their lifecycle.

Requirements
• Diploma/Degree in Electronics, Mechatronics, or a related Engineering discipline with 5–7 years of microelectronics assembly experience in a manufacturing environment.

• Strong knowledge of microelectronics assembly processes, packaging design, JEDEC/ISO standards, and operation of die attach, wire bonding, testing, and related assembly equipment.

• Able to interpret technical drawings, design assembly jigs, and preferably proficient in 2D/3D CAD software.

• Strong analytical, problem-solving, communication, and organizational skills with the ability to work independently and collaboratively.

• Comfortable working under a microscope using precision hand tools, with excellent attention to detail, steady hand-eye coordination, and the ability to distinguish colors.

Interested Parties please WhatsApp/Call us at 8893 3424 (Jasmine), and email your latest resume in WORD format to [email protected]. You may call my office number at 65698233 (Ext.839) for a private & confidential discussion.