Package Development Engineering – Product Integration Engineer (PDE PIE)

• Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.  

• Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.    

• Driving New Product Introduction process through NPI Phase Gate Review. 

• Coordinating new product start-up to achieve first pass qualification. 

• Understand new product start-up datelines, product applications and customer requirements; and communicate this information to the new product start-up team 

• Working with process / equipment / manufacturing / planning area owners to bring new product and package into volume production. 

• Providing timely support of First silicon, Engineering samples, Qual samples and meeting expectation on Engineering Hot lots cycle time as per Product Development Team (PDT) schedule. 

• Regular monitoring the product yield trend; Quality Deviation Record (QDR) and reliability to ensure that assembly operation is in control and initiate early attention if necessary. 

• Drive Electrical Failure Analysis (EFA) / Physical Failure Analysis (PFA) closure for NPI issues, including:  

• Assembly failures (crack, delamination, shorts, opens, warpage) 

• Test failures  

• Reliability failures 

• Owning the entire Product Life Cycle, from NPI to End of Life (EOL). 

• Understanding new product challenges and collaborating with Process / Equipment/Development owners to develop new technology capabilities ahead of market 

• Act as the technical integrator across multiple manufacturing sites and partners (Design, NPI, Site Process & Equipment, Package Reliability, Test, Quality) 

• Acting as a point of contact to Technical Program Manager (TPM) on product related matters. 

Minimum Required Qualifications/Experience 

Education 

• Minimum Bachelor's degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor or related Engineering discipline 

Experience 

• Fresh graduate with strong passion in semiconductor engineering is encouraged to apply.  
   

Technical Skills 

• Strong understanding of:  

• Advanced package assembly flows and able to understand design geometry 

• Various Die stacking, thin substrates, mold compound, warpage, and mechanical reliability 

• NPI qualification frameworks (Qual, Low Volume Manufacturing, Post Release Qualification) 

• Hands on experience with:  

• Yield analysis, statistical data interpretation 

• Failure analysis methodologies 

• Process characterization and validation 

• Familiarity with:  

• Phase Gate / NPI/ Technology Development (TD) business processes 

• Cross site manufacturing transfers 

Soft Skills & Leadership Attributes 

• Strong ownership mindset with ability to lead without authority. 

• Thrive in working in a fast-evolving NPI environment 

• Able to balance technical depth with execution speed 

• Strong analytical, logical, and critical thinking skills  

• Effective communicator, able to collaborate across all levels  

• Growth mindset with a passion for continuous learning  

• Internship or experience in the semiconductor industry is a plus  

• Demonstrated leadership and a track record of impact are highly desirable  

• Interest in and knowledge of the semiconductor industry and Micron is preferred  

• Ability to apply baseline digital fluency and role appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem solving, operational tasks, and achieving business outcomes. 

• Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value