Package Silicon Technology Node Development Director/DMTS

Director / DMTS – Package Development Engineering (PDE) 

Role Overview 
Micron Technology is seeking an accomplished technical leader to join our Package Development Engineering (PDE) organization as a Director / Distinguished Member of Technical Staff (DMTS). 
In this role, you will define and drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions in next-generation memory products. You will operate at the intersection of silicon, package, and system-level integration, ensuring robust technology readiness and risk mitigation across increasingly complex design and process landscapes. 
This is a high-impact, cross-functional leadership role, requiring close collaboration with global engineering teams spanning Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality. You will play a critical role in shaping future memory product success through technology innovation, risk management, and execution excellence. 

Key Responsibilities

Technical Leadership & Strategy 
• Define, develop, and maintain long-term chip-package interaction (CPI) technology roadmaps aligned with advanced silicon node transitions 
•Drive technology strategy and risk management frameworks to support future memory product launches 
• Lead global technical initiatives to ensure alignment between silicon, package, and test vehicle readiness 

Cross-Functional Collaboration 
• Partner closely with teams in: Fab Process Integration , Product Design & Development, Package Design & Assembly Technology Development, Global Quality & Reliability Engineering 
• Establish and drive CPI risk identification, modeling, and mitigation strategies across development cycles 
• Ensure seamless integration of design, process, and packaging requirements across multiple business units and geographies 

Execution & Alignment 
• Align priorities, timelines, and resource planning with senior leadership and key stakeholders 
• Drive execution rigor across programs, ensuring technology readiness and delivery milestones are met
• Influence decision-making through data-driven insights and technical expertise 

Thought Leadership 
• Serve as a subject matter expert in CPI failure mechanisms and reliability risks 
• Mentor and guide engineering teams, fostering a culture of technical excellence and innovation 
• Represent PDE in strategic discussions with internal and external stakeholders 

Requirements :
• Master’s or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or a related technical discipline 
• 15+ years of experience in semiconductor technology development, packaging, or related fields 
• Extensive experience in: Chip-package interaction and integration challenges, Electrical and physical failure mechanisms, Reliability testing, qualification, and screening methodologies

• Strong track record of technical innovation and impact, evidenced by: Publications, Patent, Industry contributions 

• Deep understanding of semiconductor process technology development, including business processes and strategic planning 
• Strong knowledge of memory technologies and semiconductor device physics (preferred) 
• Demonstrated expertise in: Chip-package interaction (CPI) failure mechanisms, Reliability physics and risk assessment methodologies, Failure analysis, qualification, and screening techniques 
• Proven ability to lead complex, cross-disciplinary programs across global organizations 
• Strong collaboration and stakeholder management skills in a matrixed environment 
• Proven experience in technical leadership, mentoring, and driving organizational impact 
• Ability to manage multiple high-impact initiatives simultaneously 
• Excellent communication and presentation skills, with the ability to influence both technical and executive audiences