Principal Engineer, HIG-HBM Product Engineering (Media Health Reliability)

As the key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will involve in both intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products. Your responsibility is to develop new reliability test flow (eg: extended wafer level burn in, pWLRx, ELFR etc), both on DRAM and Interface die and a stacked product for extrinsic DPM (Time0 and Field DPM) and intrinsic reliability assessment to meet critical KPI’s Quality, Cost and Cycle Time. You will play pivotal role in ensuring the reliability and robustness of our products through advanced coding practices and comprehensive testing. This position demands a strong grasp of engineering principles, adept problem-solving skills, and a relentless dedication to maintaining high-quality standards. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:

• Reliability Test Program Coding: Writing and debugging test programs for HBM device and package qualification and working with other teams to ensure full test coverage guarantees that all aspects of the product are thoroughly tested and any potential issues are identified and addressed.
• Root Cause Understanding and Resolution of reliability test program related issues
• Promotion of Innovation and Challenge Status Quo: The role involves promoting innovation and driving for changes (eg: innovate new reliability features and solutions, or code infrastructure optimization & handling) that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.
• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.
• Data Analysis for Validation: Utilizing in-house statistical tools for engineering data analysis for validation and risk assessment provides valuable insights into the performance and reliability of the products.
• Hardware Specifications and Validation: Defining interface hardware specifications and performing validation and debug of new interface boards ensures that the products are compatible with various hardware and can perform optimally in different environments.
• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Process Improvement: The role requires identifying system and process improvements and promoting continuous cost reduction and quality improvement efforts. These responsibilities are critical in the tech industry, where efficiency and quality are paramount.

Requirements:

• Bachelor's or Master's degree in Electrical & Electronics Engineering, Computer Science, or a related field, or equivalent experience. Product or Test Engineering experience is preferred.
• Strong knowledge of coding / programming languages such as Python / C++ is a must.
• Proven experience in reliability engineering or a related role.
• Demonstrating Strong Technical Skills, especially in problem solving with root cause understanding and solution space. Attention to detail.
• Basic understanding of CMOS technology and DRAM device physics and design.
• Good multi-tasking skills and ability to set priorities in a fast moving, dynamic environment
• Good knowledge of statistics and data analysis tools and scripting.
• Familiar with testing verification approach
• Ability to successfully implement and strictly adhere to testing protocols.
• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Work on site in Singapore with international travel to US, Taiwan and Japan