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Principal Engineer – Process Development, Dry Etch, NAND

salary Salary :

$8,000 - 13,500 monthly

Job Description - Principal Engineer – Process Development, Dry Etch, NAND

Job / Role Summary 

The Principal Engineer provides technical leadership for dry etch process development across critical NAND modules, shaping process roadmaps for current and future nodes and leading cross-functional execution to solve high-impact structural and device challenges. Success requires deep domain expertise in plasma etch, proven leadership in complex program delivery, and strong vendor engagement to close technology gaps.  

Main Responsibilities  

  • Lead dry etch unit process and critical module development; develop/innovate processes that meet advanced NAND structural and electrical specifications.  

  • Lead cross-functional teams to solve complex structural problems and drive alignment across process areas.  

  • Present and drive dry etch process and technology roadmaps for current and future technology nodes.  

  • Drive advanced scalability solutions for high aspect ratio etches, including pulsing/advanced schemes where applicable.  

  • Lead supplier head-to-heads and vendor engagements to accelerate process/hardware solutions.  

Other Responsibilities  

  • Provide technical mentorship and act as a resource for peers in dry etch technology and project execution.  

  • Provide critical status and risk updates to leadership stakeholders.  

  • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. 

  • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. 

Candidate Profile 

Minimum Qualifications / Experience 

  • PhD ≥5 yrs, or Master’s ≥7 yrs, or Bachelor’s ≥10 yrs of relevant experience in 
    Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,  

  • Significant dry etch PD/R&D experience with evidence of leading complex projects and cross-functional delivery (the current Staff/Principal requisition uses MS/PhD and BS experience ranges).  

Must-have technical skills 

  • Deep dry etch technology fundamentals (plasma physics/chemistry, reactor types/chemistries) and ability to apply mechanistic reasoning to outcomes.  

  • Strong SPC/DOE/statistical analysis and structured RCA.  

Must-have soft skills 

  • Technical leadership through influence; ability to drive alignment and execution across multiple stakeholders and sites.  

  • Strong communication and ability to present roadmaps and program updates.  

Highly desirable / preferred 

  • Data science basics / Python and AI-enabled analysis capability. 

Embody Micron’s core values: 

  • People – Respect, develop and empower others  

  • Innovation – Drive continuous improvement and breakthrough thinking  

  • Tenacity – Show grit and determination  

  • Collaboration – Build trust and foster teamwork  

  • Customer Focus – Deliver excellence and value  

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