Principal Engineer Wafer Fab Operations / Integration

Lead front-end semiconductor process integration for new-technology introduction, technology transfers and new manufacturing-site enablement. The role owns process qualification, safe launch and production ramp-up to achieve manufacturability and yield targets.

Key Responsibilities

• Coordinate process qualification and release activities with technology teams and business stakeholders.
• Lead front-end safe-launch activities and support manufacturing ramp-up.
• Drive improvements in process stability, manufacturability and yield.
• Manage new-technology introduction and process transfers.
• Make key integration decisions involving technical risks, schedules, resources, logistics and supplier dependencies.
• Lead the resolution of process-integration and production issues using device, process and yield data.

Requirements

• Degree in Physics, Electrical Engineering or a related disciplines.
  More than 12 years of front-end semiconductor process-integration experience.
• Experience in wafer fab production.
• Strong knowledge of semiconductor devices, manufacturing processes and yield-improvement methods.
• Proven leadership of process-development, transfer or production-ramp programmes.

Disclaimer

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.

Lee Shiow Chyn
EA12C6130
R1112042
[email protected]