T

Principal Software Engineer (Agentic AI)

salary Salary :

$15,000 - 20,000 monthly

icon briefcase Job Type : Full Time

Number of Applicants

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000+

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Job Description - Principal Software Engineer (Agentic AI)

Tyco Electronics Singapore Pte Ltd (TE Connectivity) is looking for a Principal Scientist/Engineer to join our Corporate R&D Center.  The Scientist/Engineer will be part of a newly formed Artificial Intelligence team to create an AI Hub for TE in Singapore.  Team members will collaborate with R&D peers, business unit partners as well as local university and government research centers to undertake projects that will embed AI in TE’s design and process development work flows to deliver a competitive advantage to TE’s technologies. This position is based at our Singapore HQ. 


The Singapore Corporate R&D Center is chartered to work with the CTO’s and Advanced Development Groups of TE Business Units to identify technical areas of interest for R&D and develop forward looking technologies that will deliver broad value to the business. In order to improve the New Product Development process, TE is expanding our Artificial Intelligence capabilities as a part of our Digitalization strategy to improve efficiency, decrease cost, and decrease time to market.  

Job Responsibilities:

  • Define and own the technical vision, reference architecture, and multi-year roadmap for an enterprise-scale agentic AI platform supporting engineering users in product design and manufacturing process development.
  • Lead the design, implementation, and deployment of secure, scalable, and reliable platform capabilities, including orchestration frameworks, retrieval, evaluation, observability, and integration with enterprise systems.
  • Align multiple business units, IT, cybersecurity, data, and global engineering teams on platform standards, governance, operating model, and adoption strategy, while guiding teams on effective platform utilization.
  • Lead complex programs and external partnerships end-to-end, including vendor evaluation, delivery governance, prioritization of high-value use cases, and realization of measurable business impact.
  • Drive technical decisions on LLMs, multi-agent/agentic AI frameworks, cloud and hybrid infrastructure, and high-performance computing to continuously strengthen platform capability.
  • Serve as a key technical member in the Singapore Corporate R&D Center, creating awareness across TE and influencing senior stakeholders on AI platform strategy, risks, and outcomes.
  • Partner with Singapore research institutes and external technology ecosystems to evaluate advanced AI techniques, guide validation, and accelerate knowledge transfer into production TE applications.

Job Requirements:

  • Master degree in Computer Science, Artificial Intelligence, Software Engineering, or a related field with 12+ years (or Bachelor degree with 15+ years, or PhD degree with 10+ years) of relevant working/research experience
  • Deep expertise in LLMs, multi-agent and agentic AI frameworks, and hands-on software engineering and programming skills
  • Proven track record deploying and scaling enterprise AI platforms or products in production, with strong architecture knowledge across cloud, data, security, DevOps, MLOps, LLMOps, and governance
  • Strong communication, stakeholder management, and influence skills across senior technical and business audiences
  • Demonstrated ability to define technical strategy and lead complex cross-functional programs independently
  • Strong interest in R&D involving hands-on coding, experimentation, and data-driven problem solving
  • Experience establishing effective delivery, project management, and execution mechanisms across multiple concurrent initiatives
  • Working knowledge of engineering domains such as materials, manufacturing processes, product design, or industrial systems

Preferred: 

  • Experience applying AI in engineering, manufacturing, or industrial R&D environments; familiarity with TE products such as connectors, cables, sensors, etc.
  • Broad knowledge of different materials' mechanical, electrical, and thermal properties, including polymers, metals, and alloys
  • Broad knowledge of manufacturing processes (molding, extrusion, plating, stamping, assembly, etc.), material development, and product design
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About the Company

TYCO ELECTRONICS SINGAPORE PTE LTD

TYCO ELECTRONICS SINGAPORE PTE LTD

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