Semicon Die Prep Staff Engineer

Responsibilities

LeadProcess Engineering for Taping, Back Grinding, Wafer Mounting, Detaping, LaserGrooving, SAW, AOI, and Tape & Reel operations.

Driveyield, quality, productivity, and cycle time improvements.

Establishand optimize process controls to meet customer requirements.

Collaboratewith cross-functional teams and customers on process improvement, NPI, andissue resolution.

Leadroot cause analysis and provide technical guidance to the engineering team.

Requirements

Degreein Engineering.

Minimum8 years of semiconductor process engineering in Taping, Back Grinding, WaferMounting, Detaping, Laser Grooving, SAW, AOI, and Tape & Reel operations.

Strongexpertise in back-end wafer processes and process optimization.

Provenleadership in yield improvement and customer support.

Proficientin JMP, DOE, FMEA, 8D, and structured problem-solving.

AllSuccessful candidates can expect a very competitive remuneration package and acomprehensive range of benefits.

Pleaseemail your resume in a detailed MS Word format to [email protected] stating

1)Current Drawn

2)Expecting Salary

3)Date Available

4)Reason to Leave each job:

Weregret that only shortlisted candidates will be notified

JoyceKoh Ai Leng

PeopleProfilers Pte Ltd

20Cecil St, #08-09, PLUS Building, Singapore 049705

Tel:6950 9737

www.peopleprofilers.com

EALicense Number: 02C4944

EAPersonnel Reg nos R1110618

JobID: JOB-00651