Senior Manager, Wafer Bumping R&D

Responsibilities:

· Technical project leader with cross functional team.

· Oversee new product development per required schedule and budget.

· Ensure smooth project execution till pre-production stage.

· Work closely and independently with internal/external customers and suppliers to evaluate new enabling process, materials and equipment through regular progress and status update.

· Enable technology offload to assembly and ensure system requirements and customers’ needs are met.

· Provide technical advice and consultation to secure business & strengthen competitiveness. Contribute actively to promoting the company’s technological capability through customers’ presentation.

· Set, align and drive goals and strategies of department. Identify and propose new package and process development for the Company’s roadmap.

· Manage resources efficiently to fulfil project/ program requirements as well as overall group performance and synergy. Provide coaching and non-technical assistance to remove barriers/ obstacles to achieve department goals.

Requirements:

· Minimum a Bachelor’s degree in Electronics, Mechatronics, Engineering, Material science or any related semiconductor manufacturing discipline.

· At least 10 years’ experience in Wafer Bumping Process Development.

· Proficient in wafer bumping processes, including PVD, Lithography, Plating, Ball drop and WLCSP backend processes.

· Strong analytical skills with hands-on experience in failure analysis and data analysis tools.

· Proven leadership capability in driving new projects and technologies from planning and design through qualification and production ramp-up, in collaboration with cross functional teams. 

· Excellent communication skills with the ability to effectively engage both internal and external stakeholders. 

· Knowledge of Fan Out technology and assembly process is an added advantage.