Senior Package Designer

Position Summary 

The Senior Packaging Designer (BGA & Substrate & WLCSP) is responsible for product and tooling design. 

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position. 

Responsibilities 

• With reference to internal design guidelines, work with the internal & external customer to: 

- Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers. 

- Generate test vehicle design and the related PCB design. 

- Prepare design risk assessment report. 

- Generate reticle and stencil design.  

- Generate other schematics or drawing as requested.  

• Review, maintenance and update the design guidelines.  

• Manage the conversion of internal design into suppliers’ final design. 

• Document all the drawing revisions and change records. 

• Support audits 

• Any other ad-hoc duties as assigned 
  

Requirements

• At least a Bachelor’s Degree in Electrical/ Electronics Engineering, or similar discipline 

• Preferably 5 - 10 years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant. 

• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability. 

• Familiar with other design software like Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors. 

• Familiar with PCB test board design.  

• Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process would be advantageous.