Senior/Principal Engineers (Advance Packaging Development)

• Work on cutting-edge advanced packaging platforms
• Strong technical growth in a fast-evolving space

About Our Client

Our client is a global semiconductor technology leader at the forefront of advanced memory solutions. With a strong culture of innovation, integrity, and sustainability, the organization invests heavily in next-generation process development and empowers. Engineers are trusted to own critical modules, interact directly with global stakeholders and vendors, and contribute meaningfully to next‑generation technology scaling. With a strong commitment to sustainability, integrity, and community engagement, the organization balances innovation with responsibility-creating a workplace where top technical talent can build enduring careers.

Job Description

Drive development of advanced packaging technologies across:

🔹 Wafer-Level Engineering

• Develop and optimize wafer-level packaging processes (e.g. WLP, FO-WLP, RDL)
• Drive process improvements in lithography, bumping, and wafer preparation
• Enhance yield, performance, and manufacturability at wafer stage

🔹 Die-Level Engineering

• Develop and improve assembly processes such as flip-chip, die attach, and underfill
• Troubleshoot process issues related to alignment, bonding, and reliability
• Drive continuous improvement in packaging performance and yield

🔹 Integration Engineering

• Lead end-to-end process integration across wafer and die-level packaging
• Analyze yield and reliability issues across the full packaging flow
• Collaborate cross-functionally to ensure successful technology deployment

The Successful Applicant

• Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
• At least 5 years of experience in semiconductor process or packaging engineering
• Experience in advanced packaging technologies (e.g. WLP, flip-chip, assembly, integration)
• Strong problem-solving skills and ability to work across multiple teams

What's on Offer

You will have the opportunity to work on cutting-edge advanced packaging technologies that power next-generation semiconductor products, with real impact on high-performance and memory solutions. This role offers strong technical depth and career growth, exposure to end-to-end development from wafer to final package, and the chance to collaborate with global engineering teams in a fast-evolving environment. In addition, the position comes with a competitive compensation package (including bonuses), comprehensive health and insurance coverage, and flexible benefits. You'll be part of a highly innovative and collaborative culture that values engineering excellence, while enjoying career progression opportunities, continuous learning, and the stability of a large-scale manufacturing environment driving future technology roadmaps.

Contact

Timothy Huang (Lic No: R1980928/ EA no: 18S9099)

Quote job ref

JN-062026-7047534

Phone number

+65 6416 9863

Michael Page International Pte Ltd | Registration No. 199804751N