Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND

Job / Role Summary 

The Staff Engineer delivers module/sub-module ownership in NAND Advanced Thin Films process development, owning defined portions of the process space (dielectric/carbon film processes via CVD/Diffusion) and driving robustness, capability, and integration readiness. Success requires strong hands-on deposition/characterization skills, cross-functional execution discipline, and the ability to translate experimental results into scalable process improvements.  

Main Responsibilities  

Process Development & Optimization 

• Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.  

• Execute well-designed experiments, analyze data, and translate results into process improvements.   

• Support scaling of dielectric and carbon film processes across nodes and platforms.  

Module Ownership (Growing Scope) 

• Own defined portions of a process module or sub-module under guidance from senior engineers; track margins, sensitivities, and integration risks.  

• Drive issue resolution for process and tool-related problems within assigned scope.  

Process Integration & Correlation 

• Work closely with integration and device teams to ensure compatibility and structural/electrical performance.   

• Correlate material, structural, and electrical data to guide process optimization; support failure analysis and root-cause investigations.  

Tool & Hardware Engagement 

• Build strong hands-on knowledge of dielectric/carbon film equipment behavior; support tool qualifications, upgrades, and transfers; partner with suppliers to improve stability/capability.  

Other Responsibilities  

• Communicate results clearly through reports, reviews, and data summaries; escalate risks with data-driven recommendations.  

• Mentor junior engineers and contribute to team knowledge sharing.  

• Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work 

Candidate Profile 

Minimum Qualifications / Experience 

• PhD ≥3 yrs, or Master’s ≥5 yrs, or Bachelor’s ≥7 yrs of relevant experience in 
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,  

• Demonstrated thin film R&D / PD experience and ability to link process conditions to material properties/device behavior.  

Must-Have Technical Skills 

• Thin film deposition fundamentals (CVD/Diffusion) and materials/chemistry/process physics.  

• Familiarity with fab metrology and film characterization methods (structural/mechanical/optical/electrical as applicable).   

• Working knowledge of plasma processes, vacuum systems, and chemical reactions.  

Must-Have Soft Skills 

• Strong execution ownership and structured troubleshooting.  

• Cross-functional collaboration and concise technical communication.  

Highly Desirable / Preferred 

• Understanding NAND thin film structure and electrical needs.  

Embody Micron’s core values: 

• People – Respect, develop and empower others  

• Innovation – Drive continuous improvement and breakthrough thinking  

• Tenacity – Show grit and determination  

• Collaboration – Build trust and foster teamwork  

• Customer Focus – Deliver excellence and value