Staff Product Development Engineer - SLT (System Level Test) Thermal & Board

THE ROLE:

We are the high-end test engineering team providing test solutions for Data Center New Product Introduction (NPI) under the Product Engineering Organization. We do exciting product development for leading-edge technology that will power the next generation processors used for high performance computing, data centers, and enterprise servers.

If you are looking for a fulfilling and challenging career as an engineer leading SLT (System Level Test) Thermal and Board SME (Subject Matter Expert), you are at the right place! As a MTS System Level Technical Lead, you will be responsible for defining, driving and enabling SLT test solution to meet NPI business milestones and KPI (test time, yield, cost, quality .The expectation is to perform leadership to have interaction with Silicon/Board/Power design teams, Product & Test Engineering teams, Customer Quality teams, software & platform teams to ramp GPU coverage with aggressive schedule while debug GPU fallout to ensure high yield. You will experience working with and learning from AMD’s talented engineering teams around the world.

THE PERSON:

We are looking for someone with strong technical, analytical, leadership and problem-solving skills, as well as demonstrating the characteristic of an independent and resourceful individual.

You will be proficient in your understanding about PCB Board and High Power Delivery (above 1kW) design methodology, Thermal dissipation as well as a broad understanding of various industry standards in OCP (Open Compute Project), such as JEDEC HBM3/4, PCIe, I2C/I3C, UEC (Ultra Ethernet Consortium) and UCIe (Unified Chiplet Interconnect Express) etc.

KEY RESPONSIBILITIES:

• Accountable to provide leadership to meet business milestone, cost and quality in GPU system level test area.
• Collaborate with internal teams to drive SLT board and power swim lane from pre-silicon, ASIC initial bring up to HVM (High Volume Manufacturing)
• Conduct engineering evaluations and analysis to drive closure of GPU production issues, qualify cutting-edge high power SLT thermal system for HVM
• Profile or characterize PI (Power Integrity), voltage droop, or power delivery issue observed on SLT platforms in collaboration with board/silicon designers
• Involves collaboration on or assuming the consultative or leadership responsibilities for a specific project or for product development initiatives
• May provide technical supervision or mentoring junior engineers
• Upscale overall team capabilities on low level system debug for AMD data center product families

PREFERRED EXPERIENCE:

• Experience and with good understanding of PCB board and Power Delivery design for high power GPU product (above 1kW), and board lifecycle from Eval to HVM (High Volume Manufacturing)
• Strong expertise with using analyzers and oscilloscopes, and other debug tools
• Knowledge and working experience on GPU and HBM architecture, SoC design and SoC power management features are a strong plus
• Strong and effective presentation, written and verbal communication skills, and the ability to work with geographically distributed product engineering teams
• Proficiency in Windows, and Linux operating systems
• Basic scripting proficiency for automation (Shell script, Perl, Ruby, Python)

ACADEMIC CREDENTIALS:

• BS/MS Electrical Engineering, Computer Engineering, or comparable disciplines

LOCATION:

Singapore