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Taping Process Engineer

salary Salary :

$4,600 - 6,000 monthly

icon briefcase Job Type : Full Time

Number of Applicants

 : 

000+

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Job Description - Taping Process Engineer

Job Summary:

We are looking for a proactive and technically skilled Process Engineer to support backend wafer level manufacturing operations activities. This role requires hands-on involvement with production tools, troubleshooting equipment, process optimization, and vendor management. The ideal candidate will be responsible for sustaining critical processes, resolving production issues, and driving continuous improvement.

Key Responsibilities:

Process Engineering (Primary responsibility)

  • Lead and sustain backend processes including Tape Expansion, UV Curing and Taping.

  • Perform hands-on troubleshooting of process related issues.

  • Drive continuous improvement initiatives to reduce cycle time, improve yield, and lower operational costs.

  • Drive permanent solutions to resolve chronic process and quality issues.

  • Lead investigation for process quality escalation.

  • Lead process buyoff and performance validation for new machines and technologies.

  • Responsible for preparing the line for internal & external audits and follow-up actions

Project Leadership

  • Lead cross-functional projects involving technology transfer, cost savings, and process enhancement.

  • Coordinate with Technology Development and Process Integration teams for new product release / quality related matters Lynne.

Requirements:

  • Bachelor’s Degree in Mechanical, Manufacturing, or related Engineering discipline.

  • Minimum 2 years of hands-on experience in semiconductor backend packaging specifically Tape Expansion, UV Cure, Taping, Reel-to-Reel processes.

  • Strong knowledge of Wafer level Taping process

  • Proficient in 5-Why Analysis, FMEA, Control Plan, OCAP, SPC, MSA , 8D report and 6 Sigma (Green Belt preferred).

  • Excellent communication and interpersonal skills; able to work with cross-functional teams.

Preferred Skills:

  • Experience with management and controls of Wafer level Taping process

  • Familiarity with Minitab, Excel, Word and PowerPoint.

  • Experience in project management is an advantage.

Others:

  • Ability to work in a fast-paced, dynamic environment and adapt to changing priorities.

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About the Company

RF360 SINGAPORE PTE. LTD.

RF360 is a Qualcomm subsidiary driving innovation in Radio Frequency Front End (RFFE). With over 4,000 employees worldwide, RF360 develops and manufactures innovative RFFE filtering solutions for mobile devices and adjacent businesses such as IoT, automotive and industrial. RF360 offers a comprehen...

Read more about the company

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