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TCB Semiconductor Packaging Technical Sales Engineer - YZ11

salary Salary :

$7,000 - 10,000 monthly

Job Description - TCB Semiconductor Packaging Technical Sales Engineer - YZ11

Position title : TCB Semiconductor Packaging Technical Sales Engineer

Location: Admiralty

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 7,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

  • Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
  • Support technical sales activities and customer discussions.
  • Benchmark competitor equipment and identify technology gaps.
  • Translate customer requirements into internal equipment specifications.
  • Develop and optimize TCB process parameters on TCB Equipments.
  • Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.
  • Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.
  • Conduct DOE and process characterization activities.
  • Work closely with Mechanical, Software, Electrical, Motion and Vision teams.
  • Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.
  • Lead machine qualification, FAT and SAT activities.
  • Act as the internal customer during machine development.
  • Support customer buyoff and onsite qualification activities.

Requirements:

  • Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.
  • 5–15 years of semiconductor packaging experience preferred.
  • Hands-on experience in TCB, Flip Chip and Advanced Packaging.
  • Experience in HBM / CoWoS / 2.5D / 3D packaging.
  • Experience in OSAT, IDM or semiconductor equipment environments preferred.
  • Experience with fluxless or N2 bonding environment is an advantage.
  • Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.
  • Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.


Tan Yen Zhen (Chen Yan Zhen) Reg No: R25138932

The SupremeHR Advisory Pte Ltd EA No: 14C7279

Original job TCB Semiconductor Packaging Technical Sales Engineer - YZ11 posted on GrabJobs ©. To flag any issues with this job please use the Report Job button on GrabJobs.
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THE SUPREME HR ADVISORY PTE. LTD

THE SUPREME HR ADVISORY PTE. LTD. Here at The Supreme HR Advisory, we pride ourselves on being a vibrant recruitment firm with strong Southeast Asia standing. We believe in customizing our services to cater to your unique needs. We are dedicated, enthusiastic and we take innovative approaches in...

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