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Technology Development Engineer (Advanced Packaging)

salary Salary :

$4,500 - 7,000 monthly

Job Description - Technology Development Engineer (Advanced Packaging)

We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners.This role will focus on advanced packaging technologies, ensuring high-quality,cost-effective, and timely product delivery while collaborating withcross-functional team.

Job Responsibilities:

  • Work on 2.5D/3D packaging platform technologies.
  • Develop bump, underfill, molding and RDL processes.
  • Collaborate with internal R&D and OSAT partners to driveHeterogeneous Integration.
  • New advanced packaging process verification and qualification.
  • Customer engagement and new product verification

Capability

  • Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus.
  • Experienced in 2.5D and 3DIC process development are plus.
  • Skill on FMEA, control plan, DOE (design of experiment) and problemsolving.
  • Good communication, self-motived and avid learner

Qualification

  • Atleast bachelor degree in electronics/electrical/physics/Materials engineeringor other relevant fields.
  • At least 2 years working experience inOSAT R&D/Packaging/Process engineer or other relevant fields.
  • ProficientEnglish oral and writing skill.
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