Urgent hiring: Technical Product Manager (MNC Semicon Backend)

Responsibilities:

• Act as the key technical point of contact for Customer Project Managers (CPMs), providing guidance on product capabilities, Customer Engineering Requests (CERs), technical enquiries, and application-related matters.

• Lead, mentor, and develop the Product Line team, including workload allocation, performance management, coaching, and competency development.

• Support product roadmap development and drive continuous improvement through market analysis, customer feedback, competitor benchmarking, machine capability assessments, and product performance monitoring.

• Build strong technical relationships with assigned key accounts and facilitate effective communication of technical information, product updates, customer feedback, and application requirements across Sales, Service, CPM, and Engineering teams.

• Ensure Product Specialists maintain strong technical and application expertise to effectively support complex customer requirements and challenging applications.

• Work closely with Engineering to define software features, product requirements, release priorities, and technical solutions based on customer and market needs.

• Gather, evaluate, and prioritize product requirements, CERs, and Continuous Improvement Program (CIP) initiatives in alignment with customer expectations, product strategy, and business objectives.

• Lead customer evaluations, product demonstrations, benchmarking activities, application testing, and process development projects to validate and enhance product capabilities.
  

Requirements:

• Bachelor’s or Master’s Degree in Engineering, or an equivalent technical qualification.

• Minimum 8 years of experience in a complex technical or engineering environment.

• At least 5 years of hands-on experience in die attach applications, preferably involving soft soldering and/or sintering processes.

• Knowledge of power semiconductor packaging technologies such as SiC, GaN, IGBT, MOSFET, power modules, DBC/AMB substrates, leadframe packages, and advanced die attach processes will be a strong advantage.

• Relevant experience in the semiconductor backend industry, preferably within Product Management, Application Engineering, Technical Project Management, or a related function.

• Strong customer orientation with the ability to build and maintain professional customer relationships.

Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [email protected]

EA License No: 13C6305

Reg. No.: R1985234 (GOH HOOI MING)

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