$2,600 - 4,500 monthly
Number of Applicants
:000+
Responsibilties
· Responsible for maintenance and repair on any of the following equipment such as Laser Mark, UV-cure, AOI, TnR, Vision Systems, Inspection Station and Packing station.
· Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.
· Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction NPI.
· Communicates with Manufacturing, Process, QA, Central Engineering (NPI), Pre-assy, to solve issues involving other group.
Requirements
· Possess wide application of most major concepts of specialization and ability to apply these concepts to a wide range of complex assignments.
· Requires through knowledge of practical applications of concepts, procedures and guidelines to solve extremely complex problems.
· Diploma in Electrical/ Electronics/ Mechanical / Mechatronics, Chemical, Material, Science or its equivalent with 3 - 8 years experience in similar field.
· Hands on experience in handling Laser Mark, UV-cure, AOI, TnR, Vision Systems, Inspection Station and Packing station.
· Useful experience in Wafer Bumping, Back grind and Wafer Saw
STATS CHIPPAC PTE. LTD.
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. With a broad technology portfolio ranging from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, fl...
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