$8,000 - 16,000 monthly
Number of Applicants
:000+
Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.
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AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
About Avago Technologies (a Broadcom Inc. Company) Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, ne...
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