Process Integration Engineer

Be part of an exciting team working on cutting-edge advanced packaging process technologies. To take charge of the development and validation of module process and collaborate with process integration to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Work with various teams to help develop leading-edge packaging CMP solutions for our customers to take from concept to mass production. This position is based in Singapore.

Responsibilities:

• Manage and execute CMP/Integration related programs, timely development of products/process capabilities for various applications.
• Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes for continual process improvement
• Validate and/or develop new process baseline, including new capability, process, feature, tools and/or materials
• Implement related metrology (eg AFM) & inspection (eg AOI) to maintain process control to ensure process stability and repeatability.
• Support new integration flow development, CMP/Integration customer demo, collaborate with customer/partner to achieve site objectives.

Experience:

• Minimum 5 years of experience in semiconductor packaging/assembly/BEOL and/or minimum 2 years of program management role
• Relevant experience on CMP/Integration process development, CMP end-point technologies, new materials, consumables/pads/slurries, etc.
• Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies
• Willing to tackle tough problems and enjoys problem solving.
• Comfortable in large corporate environments and can work with multi-functional teams across geographies/nationalities.
• Added advantage with exposure to one or more various packaging technologies such as wire-bonding, flip-chip, TCB, camera-module assembly, molding, singulation, WLCSP, MCMs, and SiP
• Requires BE or BS in Electrical, Mechanical, or Materials Science Engineering.

Work Location:

• Science Park II