CMP Process Engineer

Job Responsibilities

Process Development & Optimization                  

• Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing. 
• Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. 

Equipment & Tooling Support                   

• Define equipment specifications and validate CMP tools. 
• Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies. 

Yield & Quality Improvement                     

• Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination). 
• Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection. 

Process Integration 

• Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration. 
• Support the development of process flows for advanced packaging substrates including SAP/ Damascene, ABF/PI/PID-based technologies. 

Data Analysis & Documentation    

• Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. 
• Document standard operating procedures (SOPs), work instructions, and control plans. 

Cross-Functional Collaboration

• Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI). 
• Assist with customer qualifications and reliability testing as needed. 

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications:

• PhD or Master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field. 
• 5–10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing. 
• Hands-on experience with CMP tools. 
• Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding. 

Specialized Knowledge & Skills:

• Experience with defect analysis tools (e.g., optical inspection, SEM, AFM). 
• Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers). 
• Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes. 
• Strong analytical, documentation, and problem-solving skills. 
• Good communication and teamwork in a cross-functional environment.