Advanced Packaging Process Integration

Collaborate with cross-functional teams including process, hardware, metrology, and sensing groups for enabling process integration efforts in advanced packaging modules Identify and solve high-value problems (HVPs) at both APDC and customer sites using FabVantage methodologies. Apply data analytics to diagnose process issues and optimize performance; leverage tools like JMP, FSS, and AIx databases. Support AGS sales initiatives by creating value opportunities for upsell and service contract expansion. Document findings, create technical reports, and present solutions to internal and external stakeholders. Technical Expertise: Strong understanding of semiconductor backend and advanced packaging processes. Data Analytics: Proficient in statistical analysis, DOE, and data interpretation using JMP or similar tools; experience with AIx databases is a plus. Problem Solving: Demonstrated ability to troubleshoot complex process issues and drive root cause analysis. Communication: Clear and effective verbal and written communication skills. Collaboration: Proven experience working in cross-functional teams and customer-facing environments. Bachelor's or master's degree in engineering, Materials Science, or related field. 4-7 years of experience in semiconductor or advanced packaging industries. Hands-on experience with advanced packaging process or/and backend process integration. Strong analytical mindset and data-driven approach to problem solving. Based in or willing to relocate to Singapore