Advanced Packaging Process Integration Principal/ Staff Engineer

Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/ Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development. Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield, reliability. Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps. Owns, manage, and drive technical programs/ project, report out timely status and interface with various stakeholders/management leading to completion. At least 7 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packaging or Assembly. Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous. Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous. Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies. Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions. Demonstrate ability, experience, and good communication skills to work across different functions/ unit process owners and geographies to achieve technical outcome. Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.