Assistant Engineer (Advanced Packaging Technology Process Integration) - Hiring Now

Company : Applied Materials South East Asia

Job Type : Full Time

Number of Applicants

:

000+

This job is no longer accepting applications.

Scroll down below to view similar jobs .

Job Description - Assistant Engineer (Advanced Packaging Technology Process Integration) - Hiring Now

We are eager to add a creative Assistant Engineer (Advanced Packaging Technology Process Integration) to join our dynamic team at Applied Materials South East Asia Pte Ltd in One North, Central Region.
Growing your career as a Full time Assistant Engineer (Advanced Packaging Technology Process Integration) is an exceptional opportunity to develop essential skills.
If you are strong in persuasion, people management and have the right personality for the job, then apply for the position of Assistant Engineer (Advanced Packaging Technology Process Integration) at Applied Materials South East Asia Pte Ltd today!

At Applied Materials, our Innovations MakePossible a Better Future. We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in execution of process integration in clean room to make sure projects are completed successfully and delivered on time.

Responsibilities:

Assisting engineer to work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions
Responsible for assisting in developing advanced 2.5D and 3D SiP MEOL and assembly flows
Owner for execution of module process, data collection for measurement & inspection to validate each process in integration
Interact with internal and external module process owners to align for tool time, execute process sequence and collect data to feedback to integration owner
Occasional over-time to support process engineering activities

Requirements:

ITE/ Diploma in Engineering or relevant studies
Basic understanding on semiconductor process is preferred
Experience on MEOL & Packaging Assembly unit Process (Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be added advantages