Director, AT Capital and Advanced Packaging Cost

Establish standardized processes for Capital Requests, including NPV justification methodologies. Partner closely with Finance to refine TD and NPI cost charge structures. Define and implement scalable business processes and modeling systems that enable consistent capital and cost planning excellence. Working location: 990 Bendemeer Rd, Singapore 339942 (MSB) Manage HBM and Advanced Packaging excess, reuse opportunities, and asset transfer strategies. Lead Cost Workshops for new node MOR introductions and ensure alignment against CoT (Cost of Transition) targets defined within EPP (Establish Program Plan) reviews. Drive cross‑functional Cost Reduction initiatives with PDE, Central IE, Site IE/Cost Teams, and APE—including analysis of loading plans, capacity, capital deployment, risks, and improvement opportunities. Bachelor's degree in Engineering, Information Systems, Computer Science, or related field; or equivalent industrial engineering experience. Minimum of 10 years of experience in the semiconductor industry. Demonstrated excellence in leading and mentoring high‑performance teams. Strong communication skills, with the ability to influence stakeholders across all organizational levels. Proven project management expertise with the ability to drive complex, cross‑functional programs. Strong analytical, interpersonal, and decision-making skills, with the ability to thrive in a dynamic environment. Practical knowledge of statistics, data analysis, and structured problem‑solving. A track record of outstanding performance and leadership capability in prior roles.