Director Process Development

The Bonding Application Manager plays a critical role in advancing Applied Materials\u2019 hybrid bonding technology by leading application development, driving customer engagement, and ensuring seamless integration of bonding solutions into advanced semiconductor manufacturing workflows. This role requires a strong technical foundation, customer\u2011facing experience, and the ability to lead a high\u2011performing engineering team to deliver innovative solutions that align with strategic business and technology roadmaps.\n\nKey Responsibilities\n\n * Develop and Validate New Bonding Technologies: Collaborate with partners and customers in the research, development, and validation of cutting-edge technologies to enhance hybrid bonding processes.\n\n * Resolve Customer Issues: Address and resolve high-value customer issues, leveraging technical expertise to deliver innovative solutions.\n\n * Customer Engagement: Travel to meet customers, understand their requirements and pain points, and translate these insights into actionable strategies and solutions.\n\n * Analyze Process Integration Impact: Evaluate the effects of upstream and downstream processes on hybrid bonding technology, ensuring seamless integration and optimization.\n\n * Support Product Development Roadmap: work with the Head of Technology to drive the product development roadmap, aligning with business goals and technological advancements.\n\n * Enhance Integration Value: Focus on enhancing the integration value of the hybrid bonding system, ensuring optimal performance and efficiency.\n\n * Collaborate with Software Team: Work closely with the software team to develop capabilities that maximize the integration value of the hybrid bonding system.\n\n * Innovate Integration Solutions: Identify and implement innovative solutions to improve the integration and functionality of hybrid bonding technology.\n\n * Team Leadership: oversees a team of both new graduates and experienced engineers, providing coaching, technical guidance, and career development support to strengthen team capability and execution.\n\n\n\n\nRequirements\n\n * Degree in Engineering, Materials Science, Physics, or related field (Master\u2019s/PhD preferred).\n\n * Experience in semiconductor process engineering, hybrid bonding, or advanced packaging.\n\n * Strong customer\u2011facing, problem\u2011solving, and data\u2011analysis skills.\n\n * Proven ability to lead and develop engineering teams.\n\n * Willingness to travel for customer support and technology development.\n\n\n\n\nWork Location\n\n * Science Park II (Moving to Tampines in end 2026)\n\n\n\n\n## Qualifications\n\n### Education:\n\nBachelor\u0027s Degree\n\n### Skills\n\n### Certifications:\n\n### Languages:\n\n### Years of Experience:\n\n10 - 15 Years\n\n### Work Experience:\n\n## Additional Information\n\n### \n\n### Shift:\n\nDay (Singapore)\n\n### \n\n### Travel:\n\nYes, 20% of the Time\n\n### \n\n### Relocation Eligible:\n\nNo\n\n### Referral Payment Plan:\n\nNone\n\nApplied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. \n