Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development

Shape the technical vision for structural and electric film processes, ensuring significant impact across top-level organizational boundaries. Lead programs that span the entire engineering group, advancing innovative breakthroughs in process development. Influence industry and cross-disciplinary teams through active external collaborations and strong technical leadership. Address and solve the most challenging technical problems, guiding teams in comprehensive root cause analysis and resolution. Develop and advocate for strategies focused on cost savings, process efficiency, and large-scale yield enhancement. Own and update the structural and electric film process technology roadmap, aligning with business objectives and competitive benchmarks. Initiate and lead strategic collaborations with external partners, universities, and research institutes. Prepare and deliver high-impact technical presentations, white papers, and patent filings. Assess technical risks and make informed decisions on process development priorities and technology investments. Mastery of ALD/CVD (plasma and thermal) processes: Pioneering new deposition methods, materials, and integration strategies for innovative NAND scaling. Deep expertise in reliability modeling, process-device correlation frameworks, and advanced failure analysis across multiple technology generations. Advanced electrical evaluation: leakage, breakdown, capacitance, impedance; metrology techniques including atom probe tomography, in-line defect mapping, and Statistical Process Control (SPC). Authority in breakthrough innovation, cross-disciplinary leadership, and external technology benchmarking; influential in shaping industry standards. Guides strategic technology decisions, mentors senior technical leaders, and directs the long-term progression of structural and electric film process development (dielectric, including lowK and highK, and carbon-based films). Expert in advanced characterization: SIMS, XPS, TEM, EELS, APT, ML-assisted image analysis for HAR structures and defect mapping. Leads the conception, development, and implementation of disruptive chemistries, materials, and hardware solutions for next-generation NAND. PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field. Over 20 years of experience in Thin Film research and development for NAND process specifically Diffusion, CVD, dielectric and carbon-based Films. Industry recognition: patents, publications, invited talks, and leadership roles in technical committees or consortia.