DMTS - Package Health, APTD

Defines, leads, and drives complex, multi-disciplinary or domain-specific projects that are of critical importance to the organization. Has delivered multiple key innovations that have been efficiently implemented and widely adopted in products. Serves as a recognized technical spokesperson within the organization, providing expert-level analysis and mentorship to team members and management on project, technical, and innovation-related matters. Acts as the focal point and acknowledged authority in their area of expertise. Actively develops and mentors others, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning and excellence. Participates actively in internal technology events such as conferences, workshops, and forums, sharing knowledge and driving collaboration across teams. B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields. 10+ years of experience in semiconductor packaging, testing, or reliability engineering, preferably with complex products. 3+ years of experience as a DMTS (Distinguished/Distinguished Member of Technical Staff) in semiconducting. Hands-on experience in semiconductor packaging processes or material properties. Strong understanding of DRAM or ASIC product testing, test architecture design, and common packaging failure modes Proficiency with simulation tools and data analytics platforms for performance analysis and optimization. Demonstrated experience in leading technical teams and managing cross-functional projects effectively. Familiarity with AI/ML applications in manufacturing or reliability. Experience with package characterization (mechanical, thermal, electrical) techniques and standards. Proven problem-solving and multitasking skills. Strong communication and stakeholder management skills.