Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND

Leading Dry Etch Unit Process and Critical Module Development: Develop and innovate dry etch processes to meet structural and electrical specifications. Collaborate and lead cross-functional teams to solve complex structural problems. Present process and technology roadmaps for current and upcoming technology nodes. Work on critical modules such as HAR, Tier by tier etches, WL contacts, and staircase. Develop knowledge and expertise in related process hardware or technologies. Provide critical updates to upper management on project status and impacts Successful candidates for this position will have: Demonstrated interest in working within a research and development environment 3-10 years of experience in dry etch process development within R&D transferring to manufacturing 2-3 years of applicable NAND, DRAM, or Logic module development experience Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena Demonstrated leadership in problem-solving and managing technical projects Understanding of various types of plasma dry etch reactors Expertise in statistical process control and analysis Experience solving scalability problems of deep high aspect ratio silicon/dielectric etches Ability to lead supplier head-to-heads Preferred experience in data science basics, Python coding, or AI coding Strong computer skills, including MS Office and SAS software like JmP MS/PhD in Chemical, Mechanical, Electrical, Material Science, Physics, Molecular Physics, Physical Chemistry, Semiconductor Technology, or related fields with 4-10 years of practical experience in dry etch process development BS in Chemical, Mechanical, Electrical Engineering, Materials Engineering, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or similar fields with 7-12 years of pertinent experience