Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND

Manage efforts and set the strategy for developing process technology for assigned products in Process R&D. Handle the demands of several customers to determine priorities for your team. Collaborate with the Manufacturing Development Engineering team to meet R&D product quality and cycle time goals. Work with R&D Management, Process Integration, and High-Volume Manufacturing Sites to regularly align on project requirements, priorities, and timelines. Provide conflict resolution if issues arise. At least five years of experience leading a process development team in a semiconductor R&D or high-volume manufacturing environment. Comprehensive understanding of Plasma Dry Etch Technology. Knowledge and experience in high aspect ratio etch development. Demonstration of collaborative ways of problem solving. Understand hard mask requirements based on material properties. Positive relationship building skills, both with internal and external customers. Demonstrated structured problem-solving capabilities. Strong communication and interpersonal skills (written, verbal, and presentation). Experience in being a mentor to manage the performance of direct reports. Ability to seek opportunities for continuous improvement, as a team member, leader, and for the organization. PhD or Masters in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, along with at least 8 years of experience in the semiconductor industry concentrating on dry etch technology and managing personnel. Bachelor's degree in Physics, Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, along with at least 15 years of experience in the semiconductor sector concentrating on Dry Etch technology and managing personnel.