Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

Recipe Development and Optimization: Develop and optimize metrology recipes for various semiconductor processes Ensure that the recipes are accurate and efficient for production needs Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP) Establish inspection methodologies and best-known methods (BKM) for metrology processes Perform in-line characterization and validation of metrology recipes Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical, and critical thinking skills Effective communicator, able to collaborate across all levels Growth mindset with a passion for continuous learning Internship or experience in the semiconductor industry is a plus Demonstrated leadership and a track record of impact are highly desirable Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. Experience with Visual Basic for automation and tool integration is preferred.