Engineer, APTD CEM - Advanced Packaging Equipment Engineering

Equipment Development: Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Establish and improve equipment management projects to deliver technode requirements Evaluate and promote new equipment and materials to enhance process capabilities Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical, and critical thinking skills Effective communicator, able to collaborate across all levels Growth mindset with a passion for continuous learning Internship or experience in the semiconductor industry is a plus Demonstrated leadership and a track record of impact are highly desirable Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. Experience with Visual Basic for automation and tool integration is preferred.