Engineer, APTD CEM Advanced Packaging Wafer Level Technology Engineering

Process Development: Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect) Upgrade process capabilities and reduce production costs Establish and improve process management projects to deliver technology node requirements and scaling for next node. Evaluate and promote new equipment and materials to enhance process capabilities Set up process parameters for a variety of semiconductor equipment Evaluate, promote, and plan for new equipment and materials Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical, and critical thinking skills Effective communicator, able to collaborate across all levels Growth mindset with a passion for continuous learning Internship or experience in the semiconductor industry is a plus Demonstrated leadership and a track record of impact are highly desirable Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. Experience with Visual Basic for automation and tool integration is preferred.