Engineer, Senior (Process Development - Interconnect Plating)

## \nCompany:\n\nRF360 Singapore Pte., Ltd.\n\n## Job Area:\n\nEngineering Group, Engineering Group \u003e Hardware Engineering\n\nGeneral Summary:\n\nJob Scope\n\nResponsible for development, qualification, and high-volume production transfer of new processes, materials, and manufacturing technologies.\n\n\u2022 Ensure process readiness, robust manufacturability, and smooth ramp\u2011up through strong cross\u2011functional coordination, data\u2011driven decision\u2011making, and process leadership.\n\n\u2022 Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.\n\n\u2022 Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.\n\n\u2022 Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.\n\n\u2022 Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment.\n\nJob Responsibilities\n\nTechnology Development\n\n\u2022 Lead and/ or co-work with global process cluster on new process recipes from concept to qualification and manufacturing release.\n\n\u2022 Define process requirements, success criteria, design\u2011of\u2011experiments (DOE), and characterization plans.\n\n\u2022 Drive root\u2011cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.\n\n\u2022 Translate product requirements into process specifications and control strategies. Technology Transfer \u0026 Ramp\n\n\u2022 Work with project leader on technology transfer - from pilot line to high\u2011volume manufacturing. Adapts to shifting priorities while ensuring deadlines are met.\n\n\u2022 Lead and drive technical discussions to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.\n\n\u2022 Work with equipment team on equipment set up and process cluster on establishing critical process windows, statistical control limits, and ramp\u2011readiness criteria.\n\n\u2022 Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.\n\nEducation/ Experience Requirements\n\nBachelor\u2019s or Master\u2019s degree in Engineering (Materials Science, Chemical Engineering, Chemistry or related fields).\n\n\u2022 4+ years of experience in Interconnect Plating process engineering, process development, or as process engineer in a high-volume wafer level package manufacturing fab.\n\n\u2022 Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.\n\n\u2022 Excellent communication, technical documentation, and stakeholder management skills.\n\nSkills, Abilities \u0026 Knowledge\n\n\u2022 Resourceful with critical thinking in problem solving.\n\n\u2022 Project and priority management skills.\n\n\u2022 Experience in semiconductor, MEMS, packaging, or high\u2011volume manufacturing.\n\n\u2022 Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc.\n\n\u2022 Experience with scale-up from R\u0026D \u2192 Pilot \u2192 HVM.\n\n\u2022 Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC).\n\n\u2022 Able to multi-task, set priorities and meet critical deadlines. Maintain open communication.\n\n\u2022 Able attend training program overseas at sister\u2019s fab for up to 1 year.\n\nMinimum Qualifications:\n\n\u2022 Bachelor\u0027s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. \nOR \nMaster\u0027s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. \nOR \nPhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.\n\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm\u0027s toll-free number found here. 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