Global Quality, HBM Assembly & Test Central Snr / Staff / Principal QA Engineer

Validate 8D reports, corrective and preventive actions to ensure flawless quality assurance and governance. Drive containment, recovery, and root cause analysis for quality issues to successfully implement solutions. Perform audits and evaluations to guarantee adherence to quality benchmarks, closely monitoring Assembly & Test performance measures and reporting any discrepancies. Review and approve changes through the Global Change Process (GCP), ensuring change implementation accuracy. Develop dashboards for quality metrics using JMP, Power BI, SQL, and Tableau, demonstrating your analytical skills to pinpoint trends and areas for improvement. Participate in MRB events and implement defect reduction strategies to improve our continuous improvement initiatives. 5 or more years of experience in semiconductor assembly/test or quality engineering. Knowledge of advanced packaging (Wafer level bumping, Flip chip assembly) is preferred. Proficiency in statistical analysis and data visualization tools. Strong collaboration skills across global teams. Bachelor's degree Familiarity with scripting languages (Python, VBA) for data automation. Experience in supplier quality management and risk assessment. Ability to lead cross-site projects and virtual teams effectively. Effective communication in English and Mandarin (preferred)