Hybrid Bonding Technology Development Engineer

The Advanced Packaging Development Center (APDC) is among the most advanced wafer-level packaging labs in the world. It houses the industry\u2019s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding. APDC was established as a joint lab partnership with the Institute of Microelectronics (IME), a research institute of Singapore\u2019s Agency for Science, Technology and Research (A*STAR).\n\nWe are currently seeking for a passionate candidate to join us on exciting hybrid bonding technology development!\n\nKey Responsibilities\n\n * Develop pretreatment processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications.\n\n * Propose solutions to address the unique challenges for high-yield hybrid bonding and die stacking. Proactively initiate and conduct CnF tests to define process \u0026 hardware requirements.\n\n * Collaborate with partners to evaluate different pretreatment technologies to identify the best for HBM.\n\n * Deep dive with engineering team and/ or supplier to prototype next gen pretreatment modules based on identified technology and process \u0026 hardware requirements.\n\n * Evaluate proto chamber for hybrid bonding process for HBM. Own process optimization and drive engineering improvement.\n\n * Guide account/field teams on tough technical issues.\n\n\n\n\nOpportunities\n\n * On-job training on CoW hybrid bonding processes and challenges. Hands-on on the state-of-the-art integrated hybrid bonder.\n\n * Hands-on exposure on state-of-the-art metrologies.\n\n * Technical training on/ exposure to up \u0026 downstream integration processes.\n\n * Witness and contribute to the historical industrial inflection from micro-bump to hybrid bonding. See your innovations become real to enable high-performance AI and server chips.\n\n * Flexible working hours\n\n\n\n\nRequirements\n\n * Engineering or science university educational background.\n\n * Academic background on plasma, wet clean, and/or thermal module is a plus.\n\n * Prior hands-on experience with industrial and/or lab-scale plasma or wet cleans tools and processes is a strong plus.\n\n * 15% travel commitment to the US, Taiwan, Korea or Europe.\n\n\n\n\nWorking Location\n\n * Science Park II (Moving to Tampines end of 2026)\n\n\n\n\n## Qualifications\n\n### Education:\n\nDoctorate Degree\n\n### Skills\n\n### Certifications:\n\n### Languages:\n\n### Years of Experience:\n\n2 - 4 Years\n\n### Work Experience:\n\n## Additional Information\n\n### \n\n### Shift:\n\nDay (Singapore)\n\n### \n\n### Travel:\n\nYes, 10% of the Time\n\n### \n\n### Relocation Eligible:\n\nNo\n\n### Referral Payment Plan:\n\nEmployee Referral (Enhanced)\n\nApplied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. \n