Member of Technical Staff / Principal Product Engineer (Package PE)

Cumulative Yield Ownership: Lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization. Reduce Time 0 DPM: By improving assembly-related coverage in manufacturing flows. Enhance HBM Cube Yield: Work together with Technology Development and Packaging teams to enhance test coverages and boost HBM Cube yield. Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root causes of failures through Electric Failure Analysis (EFA) and Physical Failure Analysis (PFA), driving resolutions and improvements through cross-functional team collaboration. Support and Progress: Provide support to facilitate progress and development among team members within the team and organization. Cross-Functional Collaboration: Partner with various cross-functional teams, including Fab, HBM Technology Development, HBM Design, and Quality/Reliability teams, to ensure the comprehensive development and successful shipping of end products. Project Management: Cultivate project oversight abilities among the team to guarantee effective project completion, resulting in the punctual delivery of tech solutions. Technical Decision Making: Make final decisions on risk analysis and project prioritization, directly impacting the direction of technological development. AI/ML Advocate: Build and assess AI/ML models to boost important metrics including Quality, Cost, Cycle Time, and Scale. Subject Matter Expert: Serve as the go-to expert in your domain, providing guidance and insights to support decision-making and strategy development. Leading Complex Projects: Define and drive critical multi-disciplinary projects to ensure successful execution and completion. Organization Spokesperson and Expert: Act as the main contact and expert, providing detailed analysis on project and technical issues. Nurturing Potential Leaders: Guide and support team members to cultivate the development of upcoming technical leaders within the organization. Innovation and Improvement: Continuously seek and implement innovative solutions to improve processes and technologies. Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering with over 10 years of semiconductor industry experience, preferably in Product Engineering and Advanced Packaging. Strong leadership and technical skills, especially in problem-solving with root cause understanding and solution space through in-depth circuit analysis. Proficiency in statistics and data analysis tools and scripting. Highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment. Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. Strong sense of responsibility and accountability towards assigned roles with professional work ethics. Excellent communication, collaboration, and presentation skills. Passionate about people and technical leadership, with a drive toward ongoing learning and development in this area.