MEMS/Microfluidic Fab Yield Improvement Engineer

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Job Summary: 

We are seeking a highly motivated MEMS Wafer Fab Yield Engineer to join our advanced wafer manufacturing team. This role is responsible for driving fab yield analysis and yield improvement through strong data analytics and deep understanding of MEMS fabrication processes. The ideal candidate brings hands‑on knowledge of wafer fab yield, strong problem‑solving skills, and the ability to communicate effectively and collaborate within team and across global, cross‑functional teams.

Job Description

What a Fab Yield Improvement Engineer does at HP:

• Perform timely investigation of yield excursions, defects, and parametric shifts using data‑driven statistical analysis of fab data.
• Lead and drive yield improvement projects, from problem definition through root cause analysis, solution implementation, and sustained results.
• Develop and maintain a deep understanding of MEMS wafer fab processes, process integration, and tool interactions across the manufacturing flow.
• Partner with process integration, process, equipment, product, and operations teams to define corrective and preventive actions.
• Collaborate closely with worldwide (WW) fab, technology, and product teams to align on yield strategies, goals, share best practices, and support cross-site yield improvement initiatives.
• Prepare clear yield reports and technical presentations to communicate findings, progress, and recommendations to stakeholders.

Key Qualifications

• Bachelor or master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, Physics, or a related discipline.
• More than 2 years of experience in MEMS or semiconductor wafer fabrication, with exposure to fab processes, yield analysis, or defect investigation. Hands‑on experience in process integration or yield improvement is an advantage.
• Hands on experience of SPC, yield pareto analysis, defect density, or fab data analysis.

Individuals who do well in this role at HP typically possess:

• Strong understanding of semiconductor or MEMS wafer fab processes.
• Solid analytical and problem‑solving skills across multiple technical disciplines, with strong attention to detail.
• Good project management skills, including timeline, risk, and resource management.
• Strong interpersonal skills with the ability to work independently and in cross‑functional teams.
• Ability to perform under tight timelines in a fast‑paced manufacturing environment.
• Strong communication skills, including written, presentation, and influencing skills.
• High ownership, accountability, and an agile, results‑oriented mindset.
• Strong team player with a collaborative attitude.
• Willingness to travel overseas periodically for short‑term business trip.
• Ability to work in a cleanroom environment.

  
  Disclaimer
  This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.
   

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Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

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For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"