Module Process Engineer (Advanced Packaging)

Own process qualification for newly installed tool(s) (e.g., Bonding, Etch, CVD/PVD, CMP, Plating, etc.) to support Nano Space and P4.0 startup. Collaborate with APG and factory teams to set up MES/RMS and pre-production line for successful ramp-up. Sustain and optimize assigned process modules for internal test vehicle builds supporting heterogeneous integration. Monitor tool performance, yield, and defectivity; drive corrective actions. Partner with Business Units (BU) to enable key customer projects and technology transfers. Execute DOE for recipe development and process optimization to improve cost, cycle time, and quality. Apply model-based problem solving and root cause analysis for excursions; implement preventive measures. Work closely with integration, BU, and operations teams to meet startup and ramp objectives. Maintain process specifications, FMEA, and train technicians/associates for operational readiness. PhD/ Master/ Bachelor in Materials Science, Chemical Engineering, Electrical Engineering or related studies Knowledge of semiconductor processes (e.g., Etch, CMP, CVD/PVD, Plating, Bonding, etc). Experience in process qualification and startup for advanced packaging or front-end modules. Proficiency in DOE, SPC, and data analysis tools. Demonstrated ability in conceptual and practical problem solving. Strong communication, collaboration, and ability to thrive in a fast-paced startup environment.